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ConstructionConductor: Class A or B Compressed concentric stranded aluminum alloy 1350 per ASTM B 231. Stranded conductors are water-blocked with conductor filling compound. Conductor Shield: Extruded thermosetting semiconducting shield which is free stripping from the conductor and bonded to the insulationInsulation: Extruded, unfilled Tree-Retardant Cross-linked Polyethylene (TRXLPE) as defined in ANSI/ICEA S-94-649Insulation Shield: Extruded thermosetting semiconducting shield with controlled adhesion to the insulation providing the required balance between electrical integrity and ease of stripping. Metallic Shield: The metallic shield is flat uncoated 5-mil thick copper tape helically applied with minimum 20% overlap. A Mylar ribbon is longitudinally applied under the copper tape shield for phase identification - 1C w/Red, 1C w/Blue, and 1C w/None. Grounding Conductors: Three bare stranded copper conductor, one in each interstice. Fillers: Non hygroscopic fillers, forming a firm and cylindrical cable core. Binder Tape: A binder tape is applied to maintain core symmetry and mechanical stability. Jacket: Black, sunlight resistant, flame retardant PVC jacket tightly applied over the binder tape. Standards
NOTES: Ampacities are based on three Phase OperationIn Duct (2011 NEC Table 310.15(B)(80): Three-conductor cable in plastic duct, direct-buried, 90°C conductor temperature, 20°C ambient temperature, earth RHO of 90°C-cm/Watt, and 100% load factor, and shields short-circuited.Isolated in Air (2011 NEC Table 310.15(B)(72)): Three-conductor cable, 90°C conductor temperature, and 40°C ambient temperature, and shields grounded at one point only.In Cable Tray: Per 2011 NEC 392.80(B)(1)(b), for single conductor cables, sizes 1/0 AWG and larger, installed in a single layer in an uncovered table tray, with a maintained space of not less than one cable diameter between individual conductors, the ampacities shall not exceed the allowable ampacities stated in 2011 NEC Table 310.15(B)(72) (Aluminum), “Isolated in Air” values noted above.